New Generation of High-Performance Circuits
High Performance. Bulit to Scale
NordAmps designs, manufactures, and sells the new generation of high-performance circuits. Built to make future communication systems and radar faster, more energy-efficient and more compact than available today.
At the core is a patented semiconductor technology that solves a problem the industry has struggled with for years: how to deliver extreme performance and high-volume production at the same time. NordAmps solves this through a unique integration technology – growing nanowires vertically on a silicon wafer, separating the material challenges at the interface from the active part of the component. The result is high-quality III–V material on silicon, without the defects that have historically made this impossible – and circuits manufacturable at the scale the market demands.
A New Benchmark for High-Frequency Performance

Higher Data Rates
Enables faster transmission of voice, video, and data across the radio system.

Lower Power
Reduces energy consumption and heat dissipation, lowering operating cost.

Smaller Antenna
Allows for more compact equipment and easier installation and deployment.
Technology the Future Demands
The demand for wireless data keeps increasing – approximately 30% per year for mobile communications and 50% per year for satellite. AI is accelerating this further, requiring vast amounts of data to move rapidly across processors, servers, and data centers at a global scale. Meeting these demands means utilizing increasingly higher frequencies — and higher frequencies expose exactly where today's semiconductor technology falls short.
Silicon-based technologies are cost-efficient but provide limited performance at high frequencies. Compound semiconductor technologies that utilize III-V materials perform well but can't be produced at scale. For decades, the industry has had to choose one or the other.
NordAmps eliminates that tradeoff. Our vertical nanowire transistor technology integrates high-performance materials on standard silicon wafers. Combining the performance of compound semiconductor technology with the scalability of silicon. Every circuit is developed closely with the customer, designed to exact specifications and needs, built for seamless integration into their systems.
Latest news
NordAmps and VTT Join Forces to Advance Next-Generation High-Frequency RF Front-End Technology
Strategic partnership to establish scalable production of cutting-edge nanowire-based RF components for communication and sensing applications.
NordAmps to Showcase High-Frequency LNAs at Semicon Taiwan 2025
From 10–12 September 2025, NordAmps will participate in Semicon Taiwan, one of the world’s most influential semiconductor events. We’ll be exhibiting under the Swedish Pavilion, alongside an impressive group of innovative companies: Nefab, Alfa Laval, AlixLabs, Camfil, Excillum, and Roxtec.
NordAmps Appoints Jan Andersson as CEO to Accelerate Growth in III-V Vertical Nanowire Transistor Commercialization
Leadership transition positions NordAmps to scale its breakthrough RF technology for next-generation wireless and data infrastructure



